3D Wafer Bump & Wire Bonding AOI Inspection system

▶ Highest quality 3D Wire-Inspection.▶ With high-resolution, complete inspection is possible even    for Foot-shape.▶ Inspect Mirror-surface without Reflection problem.▶ As for PEMTRON'S unique optical technology,    Coaxial lighting was applied to 3D installation.▶ All Packages including    SIP / FCBGA / FOWLP / FOPLP / WLCSP can be dealt.▶ AOI + SPI Multi-Hybrid System.▶ With high resolution quality, inspection of small and dense parts such as    Bump, Mini LED, parts lower than 009004, etc. are optimized.